01 Procurement
Tender overview
- Buyer
- UNIVERSITY OF SHEFFIELD
- Status
- Planning
- Procurement method
- Not supplied
- Category
- goods
- CPV classification
- Not supplied
- Tender period
- Not supplied — Not supplied
Description
We are seeking equipment that can provide a wide range of bonding technologies to cater for semiconductor die to wafer, die to chip, wafer to wafer, fli-chip and other semiconductor chiplet bonding, to support our work in Heterogeneous Integration for Microelectronics and Semiconductor Systems.
This page represents one OCDS contracting process. Notices can be revised over time. Values may be estimates, award values or contract values and should be read with their displayed stage and date.
02 Awards and contracts
Published award records
No award object is present in this compiled process yet.
03 Organisations
Buyers, suppliers and other parties
UNIVERSITY OF SHEFFIELD
Firth Court, Western Bank, Sheffield, UKE32, S10 2TN, United Kingdom
Companies House RC000667 →Companies House links appear only for explicit GB-COH identifiers. BritDB does not create company links from a similar name or address.
04 Provenance
Source for this process
Contains public sector information licensed under the Open Government Licence v3.0. Official external links are available only on the source transition page.